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Interface

  • Burn-In Board

    This board is for burn-in testing of device, which is primarily used to detect defects at high temperatures (125°C) and to verify product life.

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    Hybrid Burn-In Board

    • Product Category : DDR series
    • Application System : Uni940, Uni940A 등
    • Test Speed : Max. 200 Mbps
    • BGA Pitch : 0.8
    • Board Size : 450 mm X 570 mm
    • Board Layer : Avg. 18 L (2.4T)

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    Cold TDBI(Test During Burn-In) Board

    • Product Category : MCP 등
    • Application System : DF2200
    • Test Speed : 125 Mbps
    • BGA Pitch : 0.35
    • Board Size : 450 mm X 570 mm
    • Board Layer : Avg. 18L (2.4T)

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    Normal Burn-In Board

    • Product Category : DDR series, SRAM, SDRAM 등
    • Application System :
    • Test Speed : Max. 40 Mbps
    • BGA Pitch : Min. 0.3
    • Board Size : 450 mm X 570 mm
    • Board Layer : Avg. 8L (1.6T)

  • Socket Board

    It is a board with a focus on evaluating the electrical characteristics of the device. It transmits the signal and power required for testing to the ATE for the device.

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    Memory test socket Board

    • Product Category : eMMC, MCP, eMCP, LPDDR3, etc.
    • Application System : T5503, T5588, Magnum V, Magnum VU, SHM9G, etc.
    • Test Speed : 1.6 Gbps
    • BGA Pitch : 0.3
    • Density : 192
    • Board Layer : 4.5T